Vorynex
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We are a leading manufacturer specializing in high-density multilayer printed circuit boards and specialty boards. With certifications including UL, ISO9001:2015, ISO14001:2015, CQC, IATF16949:2016, and "National Military Standard," we provide top-quality products and services. Our extensive product range includes multilayer boards, impedance boards, high-frequency boards, high TG thick copper foil boards, 5G high-speed boards, buried blind via boards, aluminum-based boards, hybrid dielectric boards, HDI, rigid-flex boards, specialty boards, and customized solutions.
Driven by technological innovation, our products are widely used in industries such as communication equipment, industrial control, automotive electronics, energy and power, medical devices, IoT, research institutions, aerospace, and defense. With over 19 years of experience, we have served over 1,000 technology innovation-oriented enterprises with rapid prototyping and mass production services. We are committed to delivering cutting-edge solutions and exceeding customer expectations in the dynamic electronics industry.
| Rigid PCB Manufacturing Capability | ||
|---|---|---|
| Category | Volume Production | Sample Processing |
| Layer count | 1-68L | 64 Layer |
| Max thickness | 10mm (394mil) | 14mm (551mil) |
| Min line width/space (Inner layer) | 2.2mil/2.2mil | 2.0mil/2.0mil |
| Min line width/space (Out layer) | 2.5/2.5mil | 2.2/2.2mil |
| Alignment capability (with the core board) | ±25um | ±20um |
| Inner layer alignment | ±5mil | ±4mil |
| Max copper | 6Oz | 30 oz |
| Holes size (mechanical drilling) | ≥0.15mm (6mil) | ≥0.1mm (4mil) |
| Holes size (laser drilling) | 0.1mm (4mil) | 0.050mm (2mil) |
| Max Unit size | 850mm X 570mm | 1000mm X 600mm |
| Max Panel size | 1250mm X 570mm | 1320mm X 600mm |
| Aspect ratio (Unit size) | 20:1 | 28:1 |
| Aspect ratio (Panel size) | 25:1 | 35:1 |
| Material (lead-free/halogen-free) | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| Material (high-speed) | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 | |
| Material (high-frequency) | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | |
| Material (Others) | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000 | |
| Surface finished | HAL, HAL-LF, ENIG, IMMERSION TIN, OSP, IMMERSION SILVER, GOLD FINGER, Hard Gold/Soft Gold Plating | |
| Special technology | Blind & buried holes, Via in pad, Semi-plating holes, Counterbore, Step mounting holes, drill Mixed RF PCB, Busbar PCB | |
We ship PCB orders with the following flexible options to match your requirements:
| Layer | Sample Shortest Lead Time | Sample Standard Lead Time | Mass Production Lead Time |
|---|---|---|---|
| 2 layer | 24 h | 3 days | 6-7 days |
| 4 layer | 36 h | 5 days | 8-10 days |
| 6 layer | 48 h | 5 days | 8-12 days |
| 8 layer | 72 h | 5 days | 9-12 days |
| 10 layer | 4 days | 7 days | 14 days |
| 12 layer | 4 days | 7 days | 16 days |
| 14 layer | 5 days | 8 days | 16 days |
| 16 layer | 5 days | 9 days | 18 days |
| 18 layer | 7 days | 10 days | 18 days |
| 20 layer and above | To be negotiated | To be negotiated | To be negotiated |
RS-274-X & RS-274-D CAD, DXP, Protel 99 SE, PADS, GC-CAM.
